Pni MS2100 Manuel d'utilisateur télécharger pdf (Page 16)

PNI Sensor Corporation 133 Aviation Blvd., Suite 101, Santa Rosa, CA 95403-1084 USA;, Fax: (707) 566-2261

For the most current specifications, please visit our website at: www.pnicorp.com DOC # 1011946 R07

21-Jan-11 Page 16 of 16-

MS2100

Specifications & Instructions

Recommended Processing Parameters

Figure 10: MS2100 Solder Profile

Table 11: Recommended Processing Parameters

Instructions for baking of PNI MS2100 Components prior to SMT

The MS2100 is shipped in a moisture resistant sealed tray containing 416 pcs (p/n 12913) or in

partial trays or smaller packages of 415 or fewer pcs (p/n 12913P) which are not sealed.

To mitigate the risk of moisture damage, PNI recommends the following procedure for all

MS2100s:

1) Peak package body temperature: 240 C

2) After the moisture seal is opened, MS2100s must be baked at 125 C (+/- 5 C) for 24

hours prior to being subjected to reflow solder or other high-temperature processes. After

this bake process is complete, the MS2100 must be mounted within 8 hours (assuming

factory conditions of temperature < 30ºC and humidity (RH) < 60% are not exceeded).

3) Unused MS2100s are to be stored in their trays and sealed. Bake as stipulated in step #2

above before use.

Note: Temperature and humidity defined by IPC/JEDEC J-STD-020

Reflow Parameter

Temperature

Time

Max Peak Temperature

240ºC

Soak Time at Peak Temperature

10-20 seconds

Ramp Down Rate

4°C/second max

Solder Melting Point

>218ºC

Moisture Sensitivity Level: Refer to handling instructions below.

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Pni MS2100 Manuel d'utilisateur Page 16